We might all be flailing wildly at our laptops to open documents soon as at least two prototype Asus laptops exist that incorporate Microsoft Kinect sensors.
The Daily was lucky enough to snag some time with what a Microsoft insider confirmed were two official Microsoft prototypes running Windows 8.
The gesture control sensors sit where the webcam would normally be (in the centre of the panel above the screen), with what looked to The Daily like LEDs beneath the display.
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Unfortunately the Murdoch-owned iPad newspaper didn’t manage to grab any pictures nor use the gesture control, but it does seem to confirm that we’ll see Kinect functionality baked into portable hardware at some point in the near future.
Kinect is already compatible with Windows, with the necessary hardware being released in February 2012 after developers were given access to the SDK late last year.
The motion-sensing peripherals have been a massive success for Microsoft on the Xbox 360, bagging well over 10 million sales and a T3 Gadget of the Year award to boot.
Semiconductor company Micron unveiled its prototype ultra-fast Hybrid Memory Cube (HMC) DRAM during the Hot Chips conference at Stanford University.
The prototype memory uses a process similar to 3D processors to stack vertically connected memory chips, which in turn allows them to function at 128GBps.
That’s a truly mind-boggling speed, bearing in mind today’s fastest DDR3 sticks can only manage a mere 12.8 GBps.
Micron reckons the HMC chips can function at 20 times the bandwidth of today’s DDR3, and could even reach speeds of up to 160 GBps.
The chips will also operate at a mind-boggling 3.2 billion 32-byte requests per second.
Low energy
If that’s not enough, the modules will consume just 10 per cent of the energy per bit that current DDR3 chips use.
Staying true to its name, Micron also said that the chips will require 90 per cent less space, which could be a boon for mobile devices and laptops.
There’s no word on a release date yet, and it could take Micron several years to perfect the chips – but even if it can deliver half of what it’s promised, it could lead to a revolution in RAM.
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Semiconductor company Micron unveiled its prototype ultra-fast Hybrid Memory Cube (HMC) DRAM during the Hot Chips conference at Stanford University.
The prototype memory uses a process similar to 3D processors to stack vertically connected memory chips, which in turn allows them to function at 128GBps.
That’s a truly mind-boggling speed, bearing in mind today’s fastest DDR3 sticks can only manage a mere 12.8 GBps.
Micron reckons the HMC chips can function at 20 times the bandwidth of today’s DDR3, and could even reach speeds of up to 160 GBps.
The chips will also operate at a mind-boggling 3.2 billion 32-byte requests per second.
Low energy
If that’s not enough, the modules will consume just 10 per cent of the energy per bit that current DDR3 chips use.
Staying true to its name, Micron also said that the chips will require 90 per cent less space, which could be a boon for mobile devices and laptops.
There’s no word on a release date yet, and it could take Micron several years to perfect the chips – but even if it can deliver half of what it’s promised, it could lead to a revolution in RAM.
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